Book of semi standard wafer flatness

The pdf file contains the uptodate semi specifications as of june 2002 that have been technically approved by the global wafer committee and are the responsibility of the north american silicon wafer committee. The ultrasort can be configured to measure wafer sizes from 2 inches to 8 inches in diameter. Stricter requirements in the wafer manufacturing process have made edge measurements important for both 200 mm and 300 mm wafers. Tropel wafer analysis systems advanced analytic and. Silicon wafer production and specifications microchemicals gmbh. Sfqr stands for site flatness quality requirements semiconductor wafer manufacturing. Background statement for semi draft document 5409 new. For 250nm design rule usage, semi standard m24 requires flatness per site sfsr of. Objective function for optimization as a basis, the model of the distribution of material removal on the wafer and the. Combined with our state of theart optical fabrication techniques and tropels renowned phaseshifting analysis software, the flatmaster semi automated wafer system offers fullform surface information with 50 nanometer accuracy in seconds. Standard orientations such as rotated notch, and are often kept in stock and available upon request. The wafer edge profile template according to semi m10707 standard.

Silicon wafer etched in either koh or hno 3 hf based etchants in order to remove the damaged surface. Specification for 450 mm wafer shipping system drafting 5070a revision to semi m76, specification for developmental 450 mm diameter polished single crystal silicon wafers re. The article is a quick and simple reference to many basic wafer definitions. The polished surface flatness of a saw substrate is critical to the process used to image the devices created by the manufacturer. When reporting site flatness values the results can be displayed as. Jeida flat silicon wafers university silicon wafer and. The size and position of each site is specified prior to measurement. The reference plane can be chosen in several different ways, depending on the parameter measured. Large diameter silicon specifications utilize specialized global and site flatness parameters 3 for example, gp3d and. Apr 01, 2005 xcalibir is used to evaluate the flatness of chucked wafers.

Your guide to semi m10302 the entire pdf file for semi 0302 is approximately 50 pages long. Ds1203 global flatness specifications bow distance between the surface and the best fit plane at the center of an unclamped wafer. Sfqr site flatness quality requirements semiconductor. Semi m71 specification for silicononinsulator soi wafers for cmos lsi. The diameter of wafer was set to be 300 mm in the model. Wafer flatness is defined as the variation of wafer thickness relative to a reference plane. It is shown that the deformation between pins with a 2mm pinpitch chuck for an 8. Bow is the deviation of the center point of the median surface of a free, unclamped wafer from the reference plane, where the reference plane is defined by three corners of equilateral triangle. When reporting site flatness values the results can be displayed as either the maximum site flatness value found on all of the wafer sites, or the flatness values for each site individually.

In fact, the semi standard for 300 mm wafers specifically requires. Flatness, thickness and thickness variation are vital factors affecting the yield of semiconductor device processing. The semi standards process has been used to create more than industry approved standards and guidelines, based on the work of more than 5,000 volunteers. About the manual semiconductor metrology system download brochure the proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs noncontact thickness measurements of semiconducting and semi insulating wafers. Flatness is an important criteria for evaluating wafer quality.

Participating in an international project the technical university of eindhoven is developing a self calibrating, traceable double side wafer flatness and thickness measurement device. Pdf scanning wafer thickness and flatness interferometer. This planarity calculation will be a result of both the overall flatness and individual device flatness. Nc2000robotic carrier, nc6800belt carrier adding resisitivity measurement module andor pn checker module system is also available. Fabrication imaging tools such as wafer steppers are subject to depth of field limitations.

Semi wafer flat m10302 specifications sydor optics. The information in this book is based on our current knowledge and experience. Enabling the 450mm transition semi, may 20 japan update. Thickness, shape and flatness measurement of semiconductor wafers.

Site flatness values are specific to individual sites on the wafer. Polished glass wafers and substrates to semi standards glass wafers and glass substrates including fused silica, fused quartz, soda lime glass, bk7, 1737f, af45, b270, d263, lasfn9, borosilicate glass, and other materials such as 99. This equipment characteristic may vary by brand and model often resulting in unique customer wafer flatness requirements. Optical flatness metrology for 300 mm silicon wafers nist. The portal allows passwordprotected access to over standards, organization of the most frequently used documents by selected, prearranged tabs, provides effortless navigation between standards documents and a powerfu.

Specification operators 9 iso 142531, geometrical product specifications gps. The control of parameters, such as thickness, total thickness variation ttv, bow, warp, and flatness, is well known to be essential to many, if not all, semiconductor processes as reflected in a number of existing standards. This class 100 cleanroom compliant system integrates a grazingincidence interferometer with industry standard robotic handling. In order to eliminate the dependence on wafer flatness, current steppers tilt the wafer and then focus the image when exposing each particular area.

Jeida flats are 10mm smaller repectively than semi standards. Semi draft document 4274 new standard test method for determining wafer flatness using the moving average qualification metric based on scanning lithography 1 purpose 1. Semi m70 test method for determining wafernearedge geometry using partial wafer site flatness. Inspection by measurement of workpieces and measuring equipment. Semi standards form the foundation for innovation in the microelectronics industry. Wafer array flatness measurement using 3d profilometry. The actual shape of the wafer edge has to fall within the template.

A true prime wafer will be very smooth, site inspected for flatness meeting a spec of at least. The second major issue is the particular wafer flatness and shape measurement parameters to be used in the specifications. Parameters most commonly specified for polished silicon wafers. This definition is based on now obsolete astm f534. Microscopegenerated data for bow and warp polished wafer. Polishing after etching, both wafer surfaces appear like the rear side of. Warp is the difference between the maximum and the minimum distances of the median. Semi mf1530 standard test method for measuring flatness, thickness, and thickness variation on silicon wafers by automated noncontact scanning notice. Corning tropel has developed a novel distance measuring. Oxide calibration wafers for noncontact dielectric testers including semilab, quantox and sdi. There is only one option of flat location for 2 diameter polished. Standard for 150mm polished monocrystalline silicon wafers without secondary flat 625 um thickness, semi m1. Table 1 lists the polishing machine specifications.

The pdf file contains the uptodate semi specifications as of june 2002 that have been technically approved by the global wafer committee and are the responsibility of the north american silicon. Profiles c and d are optimized for wafer thinning after processing. Chemical mechanical polishing cmp is an effective method to process wafers and to improve the wafer flatness. Standard test method for measuring flatness, thickness. The general trend in wafer geometry is to a larger diameter but even so the thickness incre. Semi standards technical education program step on 450 mm wafer at semicon japan 2011 semi, mar 2012. Equipment and materials international book of semi standards. The tropel ultrasort ii flatmaster semi automated wafer system is ideal for processes development, regardless of material type. How is site flatness quality requirements semiconductor wafer manufacturing abbreviated. Astmf1530 standard test method for measuring flatness. Unless otherwise indicated, all documents cited shall be the latest published versions. Semi m73 test methods for extracting relevant characteristics from measured wafer edge profiles. The portal allows passwordprotected access to over standards, organization of the most frequently.

Warp sum of the maximum positive and negative deviations from the best fit plane wafer unclamped. Silicon valley microelectronics supplies a wide variety of high quality ultra flat wafers to meet the exact controlled flatness requirements of each customer. Sfqr is defined as site flatness quality requirements semiconductor wafer manufacturing very rarely. The second major issue is the particular wafer flatness and shape measurement parameters to be used in the. Nist s infrared interferometer ir2 is a phase measuring interferometer that operates at 1. Semiviews semiviews is an annual subscriptionbased product for online access to semi standards. The flatness of the wafer can be described either by a global flatness value or as the maximum value of site flatness. Knowledge of these characteristics can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements. Status of semi standardization efforts in compound. Test wafers a silicon wafer used in process monitoring or other testing. Semi draft document 4274 new standard test method for determining wafer flatness using the moving average qualification metric based on scanning lithography 1. Guide for flatness measurement on 450 mm wafers drafting 5069 new standard. Standard products polished wafer, epitaxial wafer, cutlappedetched wafer special products lowlydoped and highlydoped wafer main applications logic, analog, discretes, microprocessors, image sensors, powerand optoelectronics, igbts portfolio 60% o 300 mm process cz products double side polished wafer epitaxial wafer ultimate silicontm.

The planarity of the devices were also calculated on average to be around 0. Wafer flatness modeling in chemical mechanical polishing. Lithography and patterning grade process test wafers differ from ordinary silicon wafers in their requirements for thickness variation, warp and site flatness. Evolution of silicon materials characterization govinfo. Decision rules for proving conformance or nonconformance with specifications 10. Wafer flatness for cd control in photolithography request pdf. Manual semiconductor metrology system for wafer flatness. Astm f1530 02 standard test method for measuring flatness. These and other shape parameters are defined in the semi standards, which also give detailed instructions on. Bow and warp of semiconductor wafers and substrates are measures of the flatness of wafers. How are jeida flats different from semi standard flats. Status of semi standardization efforts in compound semiconductors.